Applied Micro Circuits Corporation (NASDAQ:AMCC), a global leader in high–speed datacenter and optical transport, embedded Power Architecture® processing and storage solutions, announced today that NetXen, Inc., the leader in mainstream 10 Gigabit Ethernet connectivity, has chosen the company´s 10 Gigabit Ethernet QT2025 Physical Layer integrated circuit technology for use in its just announced SFP+ optical version and SFP+ direct attach copper interface dual port 10GbE SFP+ (small form–factor pluggable) adapters.
The NetXen NICs (NX3–20GxR and NX3–20GCU) will be displayed today through Wednesday in AMCC´s booth #602, Hall 9 at ECOC 2008, Europe´s largest Optical Fiber Communications Conference, taking place this year in Brussels, Belgium, 21-25 September (Exhibition: 22-24).
NetXen selected AMCC´s QT2025, a fully integrated 10 Gbps transceiver with fully–adaptive electronic dispersion compensation (EDC) that provides a high–performance interface between a MAC or a switch device and optical modules or backplane. The QT2025 also interfaces directly to SFP+ direct attach copper cabling. AMCC´s transport components allow system designers to offer the most cost–effective, high–performance, high–capacity delivery of enterprise traffic for 10 Gigabit Ethernet datacenter applications.
"The high volume server market is seeing a dramatic increase in 10 Gigabit Ethernet adoption and system designers want NIC solutions that help them make the transition cost–effectively," said Vikram Karvat, Senior Director of Marketing, NetXen. "AMCC´s QT2025 allows NetXen to design dual port SFP+ NICs that are flexible enough to be used with either the large installed base of fiber in the datacenter or with extremely cost–effective, low power direct attach copper cabling. The combination of AMCC´s PHY technology and NetXen´s Intelligent NICs with FlexLOM TM technology offers a powerful catalyst for the volume server industry´s migration to 10 Gigabit Ethernet."
NetXen NX3–20GxR is a dual port 10GbE low–profile PCI Express 2.0 card with pluggable SFP+ optical interconnect modules. As part of the company´s third–generation Intelligent NIC® line, the card is based on NetXen´s NX3031. It is a high–performance Layer 2 NIC that can support offload of TCP/IP protocols, significantly improving the throughput of servers, server appliances, and storage platforms, while reducing host CPU utilization. This allows overall system performance to scale dramatically. AMCC´s QT2025 10Gbps PHY is also used on NetXen´s NX3–20GCU for the dual port SFP+ card with direct attach copper interface.
"With customers like HP and IBM, NetXen has its finger on the pulse of the volume server market and the design expertise to produce advanced NICs that allow the cost–effective transition to 10–Gigabit Ethernet connectivity," said Neal Neslusan, Director of Marketing at AMCC. "AMCC´s low–power and robust PHY technology is ideally suited for integration into NetXen´s third–generation NICs because it helps maintain performance and power levels that are required to earn crucial design wins in this competitive market."
AMCC´s transport portfolio delivers cost–effective, high–performance, high–capacity components for enterprises and telecom providers worldwide for applications ranging from access networks to the data center. AMCC´s technology leadership in electronic dispersion compensation (EDC), forward error correction (FEC), Serdes, CDR and FRACn provides efficient and high–performance building blocks to deliver highly integrated components required by key worldwide system vendors, OEMs, and ODMs.
For more information on AMCC transport products, visit http://www.amcc.com/products/transport.html.
About AMCC
AMCC provides leadership semiconductor solutions to process, transport, and store digital information for the world´s wired and wireless networks. As a leading supplier of Power Architecture® based processors and with world–class expertise in SONET and Ethernet protocol processing, PHY technology, Storage processors and RAID controllers, AMCC´s products are the foundation of the IP Communications Revolution. AMCC´s 3ware® SAS and SATA RAID controllers deliver cost–effective, high–performance, high–capacity storage for enterprises and consumers worldwide in applications like disk–to–disk backup, near–line storage, network–attached storage (NAS), video, and high performance computing. For further information regarding AMCC, please visit our website at www.amcc.com.
About NetXen, Inc.
NetXen, Inc. is a privately held company that manufactures intelligent 10–Gigabit Ethernet networking chips that advance enterprise datacenter performance and agility. Founded in February 2002 by chip design veteran Govind Kizhepat, the company is headquartered in Santa Clara, Calif., with an office in Pune, India. NetXen´s protocol– and OS–agnostic Intelligent NICs are designed for volume 10–Gigabit deployments and are targeted at server, storage, security and networking systems. Additional information about the company and its patented chip architecture is available at www.netxen.com.
Forward–Looking Statements
This press release contains "forward–looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995. Forward–looking statements may be identified by words such as expects, anticipates, plans, believes, estimates, will or words of similar meaning. Such forward–looking statements, including statements relating to the products discussed in this press release, are subject to a number of risks and uncertainties, including the risk that the products may not be successfully or timely developed, completed or manufactured or achieve market acceptance, risks relating to general economic conditions, as well as the risks and uncertainties set forth in the Company´s Annual Report on Form 10–K, and in the Company´s other SEC filings. As a result of these risks and uncertainties, actual results may differ materially from these forward–looking statements. The forward–looking statements contained in this press release are made as of the date hereof and AMCC does not assume any obligation to update any forward–looking statement, whether as a result of new information, future developments or otherwise.
AMCC and 3ware are registered trademarks of APPLIED MICRO CIRCUITS CORPORATION. Power Architecture is a registered trademark licensed by Power.org. All other trademarks are property of their respective owners.
