Rambus Inc. (Nasdaq:RMBS):
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Who: Rambus Inc. (Nasdaq:RMBS)
Where: DATE 2008
Booth # A18
ICM
Munich, Germany
When: March 11-13, 2008
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Join Rambus at DATE 2008, the European event for electronic system
design and test, for demos and displays of our latest technology
developments.
Rambus Demos and Displays
-- The Terabyte Bandwidth Initiative, featuring new memory
signaling innovations that facilitate data rates of 16Gbps and
a future memory architecture that can deliver an unprecedented
terabyte per second (TB/s) of memory bandwidth (1 terabyte =
1,024 gigabytes) to a single System-on-Chip (SoC). Innovations
include the industry´s first differential signaling for both
data and command/address (C/A); FlexLink(TM) C/A, the
industry´s first full-speed, point-to-point C/A link; and 32X
Data Rate technology (32 data bits per input clock cycle).
-- A multi-Gbps low-power signaling demonstration with a test
transceiver dissipating only 14 mW, resulting in a
power/performance metric of 2.2 mW/Gbps, a power reduction by
a factor greater than three times (3x) that of traditional
serial links.
-- The award-winning XDR(TM) memory architecture, a differential
memory system solution, operating at 5.6Gbps with
FlexPhase(TM) circuit technology calibration and Octal Data
Rate (ODR) read/write operation.
-- A low-cost XDR system solution implemented on a 2-layer
printed circuit board.
-- A DDR3 memory controller interface signaling demonstration at
1066Mbps.
-- A Texas Instruments(R) DLP(R) open demo board featuring XDR
technology. In this application, the Rambus XDR memory
interface operates at 4.0Gbps and brings unparalleled memory
performance to the TI DLP processor.
-- A PLAYSTATION(R)3 (PS3(TM)) open demo board featuring XDR
technology. The Rambus XDR memory interface and FlexIO(TM)
processor bus enable an unprecedented aggregate bandwidth of
over 90 gigabyte-per-second between the Cell Broadband
Engine(TM) and supporting chips at the heart of the PS3.
For registration and additional information, please visit
http://www.date-conference.com.
About Rambus Inc.
Rambus is one of the world´s premier technology licensing
companies specializing in the invention and design of high-speed
memory architectures. Since its founding in 1990, the Company´s
patented innovations, breakthrough technologies and renowned
integration expertise have helped industry-leading chip and system
companies bring superior products to market. Rambus´ technology and
products solve customers´ most complex chip and system-level interface
challenges enabling unprecedented performance in computing,
communications and consumer electronics applications. Rambus licenses
both its world-class patent portfolio as well as its family of
leadership and industry-standard interface products. Headquartered in
Los Altos, California, Rambus has regional offices in North Carolina,
India, Germany, Japan, Korea and Taiwan. Additional information is
available at www.rambus.com.
Rambus and the Rambus logo are registered trademarks of Rambus
Inc. XDR, FlexPhase and FlexLink are trademarks of Rambus Inc. All
other trade names are the service marks, trademarks, or registered
trademarks of their respective owners.
