Tessera Technologies, Inc. (Nasdaq: TSRA), a leading provider of
miniaturization technologies for the electronics industry, today
announced the MicroPILR(TM) Interconnect platform, a highly innovative
technology family that is designed to revolutionize the interconnect
within semiconductor packages, substrates, Printed Circuit Boards
(PCBs) and other electronic components. The novel interconnection is
achieved through low-profile, pin-shaped contacts which replace
conventional technologies used today, such as solder balls on
semiconductor packages and plated vias in package substrates and PCBs.
These contacts deliver a number of key benefits needed to meet
emerging product roadmaps, including significantly reduced profile,
fine pitch, improved electrical and thermal performance, and enhanced
reliability. By addressing the technical limitations of current
generation interconnect, Tessera's MicroPILR platform has the
potential to become a fundamental building block of next-generation
mobile, computing and consumer electronic products.
A key demonstration of the technology has been in a high density,
package stacking application. Working closely with one of the world's
preeminent semiconductor manufacturers, Tessera has developed an 8-die
FLASH package stack that is less than 1.2 mm thick. Each individual
package can be tested prior to stacking which results in near 100%
stacked yield.
According to Mr. Shozo Saito, Corporate Vice President and
Executive Vice President of Semiconductor Company, Toshiba
Corporation, "We have been evaluating Tessera's MicroPILR platform for
many months. Our initial technical results on the stacking of multiple
NAND Flash devices in this low profile packaging technology are
promising. Tessera has been pioneering advanced interconnect
technologies for nearly two decades, and the MicroPILR platform is an
innovative new technology offering."
According to Bruce McWilliams, Tessera's Chairman, President and
CEO, "Tessera developed the MicroPILR(TM) platform to enable the
ongoing evolution of electronics, which will require breakthroughs in
interconnect to achieve greater levels of integration and
functionality at lower levels of cost. Tessera is actively engaged
with key members of the supply chain, including leading semiconductor
manufacturers, subcontract assemblers, and materials suppliers, to
drive widespread adoption of Tessera's MicroPILR platform. We look
forward to offering our customers and the global electronics industry
a powerful tool in meeting next-generation product roadmaps."
With the unveiling of this new technology, Tessera is introducing
its next-generation packaging family while significantly expanding its
product offering to include PCBs and other interconnect applications.
Prismark estimates the interconnect market (including multilayer PCBs
and advanced package assembly) will grow from approximately $34Bn in
2006 to $51Bn in 2011. According to Brandon Prior, Senior Consultant,
Prismark, "The MicroPILR(TM) platform targets the fastest growing
areas of advanced interconnects which include 3D package solutions and
advanced substrate technologies. It addresses many of the challenges
faced by other 3D solutions including height reduction, test, and
manufacturability."
Licensing
Tessera is actively engaged with the global supply chain to drive
high volume adoption of the MicroPILR technology family. The first
implementation of the technology family available for licensing is for
packaging and packaging substrate applications. Tessera is also
offering related services, such as technology transfer and training,
and prototype samples are available.
Technical Overview of MicroPILR Interconnect Platform
Tessera's MicroPILR technology platform leverages existing
assembly processes and infrastructure to enable rapid integration into
next-generation electronics. MicroPILR pins can be used as internal or
external interconnections in a variety of applications, including the
interconnection between semiconductor die and package substrates,
semiconductor packages and PCBs, the layers within package substrates,
and PCBs to PCBs.
MicroPILR pins can be formed directly onto substrates and are
typically nickel/gold plated copper. They currently range from 25 to
175 microns in height and 40 to 200 microns in pin tip diameter, with
height and diameter dimensions varying depending on application. In a
die to package substrate application, MicroPILR technology is capable
of enabling contact pitches down to 100 microns. In package to PCB
applications, pitches down to 0.3 mm or lower can be achieved; and
within package substrates, pitches of 150 micron or lower are
possible.
MicroPILR Pins Applied to Advanced Packaging
The advanced attributes of the MicroPILR platform make it possible
to package a broad range of semiconductor devices, from small die with
low I/O to large die with high I/O. Devices can be packaged in
single-chip, multi-chip, package-on-package, and other configurations.
Specific device applications include: high density stacked Flash, DRAM
and SRAM packaging; logic plus memory packaging; and stacked and
mobile memory packaging. The finer pitch benefits of the technology
also make it an attractive packaging solution for next-generation
FPGAs and microprocessors, and the improved electrical and thermal
performance provide key benefits for RF device packaging.
The replacement of solder balls with MicroPILR pins reduces
package height up to 50% over BGA technologies used today. In stacking
applications, the ability to test & burn-in each individual package
before stacking enables near 100% stacked yields. In addition, the
highly co-planar aspect of the MicroPILR pins are designed to enable
socketless testing if needed, which can reduce testing cost, simplify
testing, reduce test socket maintenance, and help to minimize the
parasitics associated with high speed testing today. Tessera has
developed a 150 micron package that the company believes is the
world's thinnest individually testable and stackable package. For more
information on Tessera's MicroPILR technology family, go to
www.tessera.com.
About Tessera Technologies, Inc.
Tessera is a leading provider of miniaturization technologies for
the electronics industry. Tessera provides a broad range of advanced
packaging, interconnect, and consumer optics solutions which are
widely adopted in high-growth markets including consumer, computing,
communications, medical and defense electronics. Tessera's customers
include the world's top semiconductor companies such as Intel,
Samsung, Texas Instruments, Toshiba, Micron and Infineon. The
company's stock is traded on the Nasdaq National Market under the
symbol TSRA. Tessera is headquartered in San Jose, California.
www.tessera.com.
Safe Harbor Statement
This press release contains forward-looking statements, which are
made pursuant to the safe harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements involve
risks and uncertainties that could cause actual results to differ
significantly from those projected. Material factors that may cause
results to differ from the statements made include failure to achieve
the revenues, cost savings, growth prospects and any other synergies
expected from the transaction; and delays and challenges associated
with integrating the companies, including employees and operations,
after the transaction is completed. Other factors that might cause or
contribute to such differences include, but are not limited to,
fluctuations in Tessera's operating results due to the timing of new
license agreements and royalties, Tessera's ability to protect its
intellectual property and the risk of a decline in demand for
semiconductor products. You are cautioned not to place undue reliance
on the forward-looking statements, which speak only as of the date of
this release. Tessera's filings with the Securities and Exchange
Commission, including its Annual Report on Form 10-K for the year
ended December 31, 2006, and its Quarterly Report on Form 10-Q filed
for the quarter ended September 30, 2006 include more information
about factors that could affect the company's financial results.
Note: Tessera and the Tessera logo are registered trademarks and
MicroPILR is a trademark of Tessera. All other company, brand and
product names may be trademarks or registered trademarks of their
respective companies.
