Empresas y finanzas

AMD Announces Socket Compatibility Plans to Drive Industry Collaboration; Sun Microsystems, Cray, Fujitsu Siemens Computers, HP, Dell and IBM Endorse Open Collaboration through AMD Torrenza Initiative to Enable Socket-Compatibility



    AMD (NYSE:AMD) today announced that its Torrenza
    Initiative is serving as a collaborative force toward achieving future
    processor socket compatibility in the server industry. By leveraging
    the advantages of AMD64 with Direct Connect Architecture and
    HyperTransport(TM) technology, OEMs will be able to standardize on a
    Torrenza Innovation Socket for many of their current and future server
    platforms. This game-changing approach to server design will enable
    OEMs to consolidate server offerings for multiple processors to
    potentially a single platform, reducing datacenter disruption and
    deployment costs for customers. The Torrenza initiative is
    establishing AMD64 as the Open Innovation Platform.
    Leading server OEMs that develop silicon or intend to design
    products uniquely enabled by the Torrenza Initiative, including Cray,
    Fujitsu Siemens Computers, HP, IBM, Dell and Sun Microsystems, have
    endorsed Torrenza as an open innovation initiative, and plan to
    evaluate the Torrenza Innovation Socket.
    "This next phase in the Torrenza initiative would not be possible
    without the enthusiasm and desire of our partners to enable open
    innovation and greater collaboration across the computing ecosystem,"
    said Marty Seyer, senior vice president, Commercial Segment, AMD.
    "Together, we recognize that the impact of Torrenza can be
    far-reaching across the industry in reducing complexity for customers
    while increasing the pace of innovation both in silicon and platforms.
    Datacenter managers will immediately recognize the impact of the
    Torrenza open environment, and benefit from the enhanced cooperation
    at the platform level, with new levels of platform stability,
    upgradeability, flexibility, and capabilities for their server
    infrastructure."

    The Torrenza Advantage

    The Torrenza Innovation Socket enables OEMs who develop their own
    silicon to take full advantage of an x86 environment and the
    accompanying economics associated with packaging, chipsets and
    motherboard designs. OEMs will be able to contribute to and obtain the
    Torrenza Innovation Socket Specification and associated design
    documentation.
    "As a leader in the open movement, IBM applauds AMD for taking
    this step and always welcomes partners that take an open and
    collaborative approach to innovation," said Bernie Meyerson, IBM
    Fellow and chief technologist, IBM Systems & Technology Group. "By
    working with AMD and joint clients such as Los Alamos National
    Laboratories, we are collaborating to deliver new value by leveraging
    this open approach."
    "Sun sees incredible innovation opportunity associated with this
    latest step in the Torrenza initiative across all of our product
    lines," said Mike Splain, chief technologist and CTO, Systems Group,
    Sun Microsystems. "Developing silicon for the Torrenza Innovation
    Socket is something we are currently evaluating for all Sun platforms
    as it presents an interesting value proposition for leveraging volume
    economics while giving our customers the growth flexibility they
    require."
    "When combined with our HP BladeSystem Solutions Builder Program,
    the AMD Torrenza initiative becomes a very effective way to deliver
    high-value computing services to specialized market segments," said
    Dwight Barron, HP Fellow and chief technologist, BladeSystem Division,
    HP. "The industry has been looking for a way to leverage
    industry-standard, high-volume IT components to solve the next tier of
    specialized computing problems, and HP sees this as a way to address
    that need."
    "Supercomputing places heavy demands on performance and thus
    innovation," said Jan Silverman, Cray's senior vice president of
    corporate strategy and business development. "Our Adaptive
    Supercomputing vision puts us on the edge of computer technology
    advancements. With the Torrenza Innovation Socket and the emerging
    Torrenza ecosystem, we can leverage additional innovations to extend
    the realized performance people have come to expect from Cray."
    "Fujitsu Siemens Computers sees the value in AMD's Torrenza
    initiative, and has already developed technology for it. We are able
    to connect two 2-socket servers seamlessly, turning them into a 4-way,
    or 8-core SMP as a result of Torrenza," said Joseph Reger, CTO,
    Fujitsu Siemens Computers. "Upgradeability of systems from 2-way to
    8-core is a Torrenza innovation from Fujitsu Siemens Computers that
    improves customers' server longevity, and reduces total cost of
    ownership."
    "Dell is excited about the open innovation approach provided by
    AMD. The benefits of purpose-built processing elements complementing
    the AMD Opteron processor are powerful," said Kevin Kettler, Chief
    Technology Officer, Dell. "The flexibility of Torrenza Initiative
    technology will allow Dell to continue to deliver cutting edge
    solutions to our enterprise customers."
    Through the Torrenza Initiative, the AMD64 computing platform is
    opened for industry-wide innovation, such as connecting non-AMD
    accelerators to AMD64 systems via HyperTransport technology links.
    Torrenza supports a range of integration innovations from
    interconnections leveraging HyperTransport, to co-processors accessing
    HyperTransport, to plug-in co-processors that directly harness the
    speed and communications delivered by HyperTransport.

    About the AMD Opteron(TM) Processor

    Today, 90 percent of the top 100 and more than 55 percent of the
    top 500 of the Forbes Global 2000 companies or their subsidiaries rely
    on AMD Opteron processor-based systems. AMD Opteron processors deliver
    exceptional performance and performance-per-watt to the market because
    they are built on AMD64 technology with Direct Connect Architecture,
    innovated to reduce bottlenecks inherent in traditional front-side bus
    architectures and enable a more efficient approach to computing.

    About AMD

    Advanced Micro Devices (NYSE: AMD) is a leading global provider of
    innovative microprocessor solutions for computing, communications and
    consumer electronics markets. Founded in 1969, AMD is dedicated to
    delivering superior computing solutions based on customer needs that
    empower users worldwide. For more information visit www.amd.com.

    AMD, the AMD Arrow logo, AMD Opteron, and combinations thereof,
    are trademarks of Advanced Micro Devices, Inc. HyperTransport is a
    licensed trademark of the HyperTransport Advanced Technology
    Consortium. Other names are for informational purposes only and may be
    trademarks of their respective owners.