Data Centre Power and Cooling Summit Focuses European Business Attention on Critical Issues

The Power and Cooling Summit 2006
(www.datacentres.com/pac) for forward looking data centres, taking
place October 25-26 in London, is the first meeting in the sector to
focus European attention on the two foremost critical issues that
impact all businesses globally.
The Summit will be officially opened by Sir Anthony Cleaver,
chairman of IX Europe and will be attended by a target rich audience
of speakers and representatives from Europe, the Middle East, India
and the US, the Summit will assess challenges and opportunities for
power and cooling in the medium and long term. Global design and
business consulting firm Arup will also provide a special workshop at
the Summit, dealing with short term solutions for power and cooling in
data centres, and making a difference now.
Sponsors include many of the business leaders in the data centre
sector, including Emerson Network Power, APC, Active Power, Corning
Cable Systems, IX Europe, Rittal and The Colocation Exchange. The
academy of speakers also includes experts from HP, IBM, Sun
Microsystems, Norman Disney Young, Hurley Palmer Flatt, Dispersia and
the University of Missouri-Colombia.
The Summit will feature informative debate covering the crucial
challenge of heat, and technologies to mitigate and reduce power
consumed. The Power Panel at the Summit will provide a knowledge bank
of experts to discuss alternative power, and whether the cost of power
will provoke a change in the pricing structure of data centres.
Optimising racks, and whether the demands confronting their design
will lead to 35Kw racks or higher will be addressed in depth. A panel
of enterprise owned and managed data centres will add valuable case
study material to the Summit perspective of how to tackle challenges
in the medium to long term.
An equally impressive array of expertise will focus on cooling,
and discuss the merits of water and liquid cooling. New solutions will
feature including Nanofluid technologies, thermal packaging and
cooling at the chip level, which will collectively offer a detailed
insight into the profound changes in cooling that are on the horizon.
"Power and Cooling leads the way as a conduit for thought
leadership in this critical debate," commented Philip Low at
BroadGroup, the summit researchers and producers. "At a time when the
US government has already initiated investigations into the power
consumption of data centres in the US, European businesses need to
understand what, how and when to adopt new solutions but equally so
the steps they should take in the interim. It promises to be a
fascinating and informative summit."