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Rambus to Demonstrate High-Speed Memory Technologies and Architectures at DATE 2008


    Rambus Inc. (Nasdaq:RMBS):

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    Who: Rambus Inc. (Nasdaq:RMBS)

    Where: DATE 2008
    Booth # A18
    ICM
    Munich, Germany

    When: March 11-13, 2008
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    Join Rambus at DATE 2008, the European event for electronic system
    design and test, for demos and displays of our latest technology
    developments.

    Rambus Demos and Displays

    -- The Terabyte Bandwidth Initiative, featuring new memory
    signaling innovations that facilitate data rates of 16Gbps and
    a future memory architecture that can deliver an unprecedented
    terabyte per second (TB/s) of memory bandwidth (1 terabyte =
    1,024 gigabytes) to a single System-on-Chip (SoC). Innovations
    include the industry´s first differential signaling for both
    data and command/address (C/A); FlexLink(TM) C/A, the
    industry´s first full-speed, point-to-point C/A link; and 32X
    Data Rate technology (32 data bits per input clock cycle).

    -- A multi-Gbps low-power signaling demonstration with a test
    transceiver dissipating only 14 mW, resulting in a
    power/performance metric of 2.2 mW/Gbps, a power reduction by
    a factor greater than three times (3x) that of traditional
    serial links.

    -- The award-winning XDR(TM) memory architecture, a differential
    memory system solution, operating at 5.6Gbps with
    FlexPhase(TM) circuit technology calibration and Octal Data
    Rate (ODR) read/write operation.

    -- A low-cost XDR system solution implemented on a 2-layer
    printed circuit board.

    -- A DDR3 memory controller interface signaling demonstration at
    1066Mbps.

    -- A Texas Instruments(R) DLP(R) open demo board featuring XDR
    technology. In this application, the Rambus XDR memory
    interface operates at 4.0Gbps and brings unparalleled memory
    performance to the TI DLP processor.

    -- A PLAYSTATION(R)3 (PS3(TM)) open demo board featuring XDR
    technology. The Rambus XDR memory interface and FlexIO(TM)
    processor bus enable an unprecedented aggregate bandwidth of
    over 90 gigabyte-per-second between the Cell Broadband
    Engine(TM) and supporting chips at the heart of the PS3.

    For registration and additional information, please visit
    http://www.date-conference.com.

    About Rambus Inc.

    Rambus is one of the world´s premier technology licensing
    companies specializing in the invention and design of high-speed
    memory architectures. Since its founding in 1990, the Company´s
    patented innovations, breakthrough technologies and renowned
    integration expertise have helped industry-leading chip and system
    companies bring superior products to market. Rambus´ technology and
    products solve customers´ most complex chip and system-level interface
    challenges enabling unprecedented performance in computing,
    communications and consumer electronics applications. Rambus licenses
    both its world-class patent portfolio as well as its family of
    leadership and industry-standard interface products. Headquartered in
    Los Altos, California, Rambus has regional offices in North Carolina,
    India, Germany, Japan, Korea and Taiwan. Additional information is
    available at www.rambus.com.

    Rambus and the Rambus logo are registered trademarks of Rambus
    Inc. XDR, FlexPhase and FlexLink are trademarks of Rambus Inc. All
    other trade names are the service marks, trademarks, or registered
    trademarks of their respective owners.