Staktek Announces Stacking Solution for Mobile Processors and Industry Standard Memory

Staktek Holdings, Inc. (Nasdaq:STAK), a market-leading provider of
intellectual property and services for next-generation, chip-stacking
and module technologies, announced MobileStak(TM), a chip-stacking
solution that enables smaller mobile products by combining virtually
any processor, controller and memory device into a single, small
footprint module. Now available for sampling is a MobileStak reference
design that integrates the FreeScale i.MX31 processor with a Micron
64MB mobile DRAM device - both supplied in pre-tested BGA packages.
The resulting 457-pin BGA module has a size of only 12.3mm x 20.3mm x
2.34mm.

The MobileStak designs can integrate a variety of chip packages,
as well as devices provided as bare die. The MobileStak is based on
Staktek's intellectual property and know-how in producing folded-flex
packaging. Over 2.5 million folded-flex stacks based on Staktek's
technology have been produced to date.

"MobileStak is an innovative form of 3D packaging, and offers the
ultimate flexibility in component selection to portable product
designers," said Robert Fan, Vice President and General Manager of
Staktek's Corporate Strategic Business Development. "MobileStak
overcomes common limitations of alternative packaging solutions, such
as long lead times, aggregate die yield issues, large minimum volume
commitments, and limited choice of components."

"We are definitely seeing an increase in the usage of stacked
processor and memory solutions across a variety of high-volume
portable electronic products, such as smart phones and portable
industrial equipment," said Jan Vardaman, President of TechSearch
International, an Austin-based technology research firm. "The Staktek
MobileStak solution lowers the barrier of entry for an even broader
set of products and applications."

With MobileStak, multiple, heterogeneous devices like processors,
controllers and memories are assembled onto a flex circuit with a ball
grid array interface to connect to a system motherboard. The flex
assembly is folded, thereby stacking the devices into a single, small
footprint module. The resulting BGA solution is just slightly larger
than the largest of the stacked packages. Since pre-packaged,
pre-tested components can be used to build the MobileStak, issues
related to sourcing and handling bare-die can be minimized, and high
yields can be achieved. In addition, when a very thin solution is
required, bare dies can be integrated into MobileStak to reduce the
overall module thickness.

More information about Staktek's MobileStak solution is available
online at http://www.staktek.com or by contacting sales@staktek.com.

About Staktek:

Staktek is a market-leading provider of intellectual property and
services for next-generation, chip-stacking and module technologies
for high-speed, high-capacity systems. Staktek's TSOP and BGA memory
stacking solutions increase operational performance by doubling,
tripling or quadrupling the amount of memory in the same physical
footprint as required by standard packaging technologies. Staktek's
ArctiCore(TM) is a new module technology using a double-sided,
multi-layer flexible circuit folded around an aluminum core and is
designed for superior thermal, mechanical and electrical performance.
With an IP portfolio of more than 200 patents and patent applications
pending, the company offers flexibility for customers, including
outsourced manufacturing, technology licensing and custom engineering.
Headquartered in Austin, Texas, Staktek operates an ISO-certified
manufacturing facility in Reynosa, Mexico. For more information, go to
http://www.staktek.com.

Staktek is a trademark of Staktek Group LP. All other products
names noted herein may be trademarks of their respective holders.