Empresas y finanzas

Toshiba and Kaga Toshiba Celebrate the New Opening of the New 200mm Wafer-Based Production Fab

15/10/2007 - 11:35
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    Toshiba Corporation and Kaga Toshiba Electronics Corporation (Kaga
    Toshiba) today marked the official opening of a new semiconductor
    production fab based on 200mm wafers at Kaga Toshiba, a consolidated
    subsidiary of Toshiba based in Ishikawa prefecture, Japan. The new fab
    will enhance production capacity for power devices.

    Demand is growing for power devices that control current flow and
    voltage conversion in digital consumer products, including TVs and
    personal mobile equipment, and hybrid vehicles. Toshiba and Kaga
    Toshiba's investment in the new production fab will increase capacity
    for these key devices.

    The new fab came on-line at the end of September, completing the
    first phase of an investment program in a new building and production
    equipment that is expected to be total 55 billion yen in the five
    years from FY2006 to FY2010. The new fab is planned to ramp up to
    60,000 wafers a month, and capacity may be further expanded to meet
    market growth. This new fab will reinforce Toshiba's drive to become
    the world's leading manufacturer of power devices.

    Toshiba Group's well-balanced semiconductor business covers three
    major product areas: system LSIs, memories and discrete devices. Kaga
    Toshiba operates as a key Toshiba Group facility for discrete devices,
    carrying out product development and front- and back-end processes for
    small-signal devices and power devices.

    "We promote investments that reinforce our position and
    capabilities in our core markets," said Mr. Keizo Tani, Executive Vice
    President of Toshiba's Semiconductor Company and Vice President of
    Discrete Semiconductor Division. "Alongside our proactive investments
    in NAND Flash memory at Yokkaichi Operations and cutting-edge LSI at
    Oita Operations, we are promoting this investment in Kaga Toshiba in
    order to expand our businesses in power devices, a key product area,
    and to reinforce the overall profitability of the semiconductor
    business."

    Mr. Tatsuro Mitani, President of Kaga Toshiba Electronics, also
    welcomed the new facility: "Power devices have a very promising
    future," he said, "and this market-appropriate investment will
    strengthen our discrete business and allow us to generate sustained
    profit. Our goal now is to use this new fab to position Toshiba as the
    world leader in power devices."

    Overview of Kaga Toshiba Electronics Corporation:

    -0-
    *T
    Location: 1-1, Iwauchi-cho, Nomi-shi, Ishikawa Pref., Japan
    Established: December 6, 1984
    President and
    Representative Tatsuro Mitani
    Director:
    Employees: Approx. 850
    Capitalization: 3.3 billion yen (Wholly-owned subsidiary of Toshiba)
    Main Products: Discrete semiconductors (small-signal devices and
    power devices)
    *T

    Overview of new production fab:

    -0-
    *T
    Structure of Building: Steel frame concrete, two stories
    Total Floor Area: approx. 23,000m2
    Start Construction: September, 2006
    Completion: May, 2007
    *T

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